The global Thin Wafers Temporary Bonding Equipment market was valued at US$ 116.5 million in 2019 and it is expected to reach US$ 199.7 million by the end of 2026, growing at a CAGR of 7.7% during 2021-2026.
Thin Wafers Temporary Bonding Equipment is to closely combine two mirror polished homogeneous or heterogeneous wafers through chemical and physical actions. After wafer bonding, atoms at the interface react under the action of external forces to form a covalent bond, and make the bonding interface reach a specific bonding strength.
The globalThin Wafers Temporary Bonding Equipment consumer market is mainly concentrated in China, Japan, Europe and the United States and other regions. Among them, China’s Thin Wafers Temporary Bonding Equipment sales share is the largest, accounting for about 31% of the global market in 2019. Japan accounts for about 24%, while Europe and the United States account for about 14% and 9%.
Thin Wafers Temporary Bonding Equipment can be widely used in MEMS, Advanced Packaging, CMOS and others. The MEMS market is the largest consumer market, accounting for about 35% of the market in 2019. Advanced Packaging is the second largest market, about 31%.
EV group, suss microtec, Tokyo electron, AML, Mitsubishi, Ayumi industry, Smee, etc. EV group is the world’s leading enterprise, accounting for 55% of the global revenue in 2019. Suss microtec is the second largest enterprise in the world, accounting for about 21% of the global market.
Global Thin Wafers Temporary Bonding Equipment Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Thin Wafers Temporary Bonding Equipment Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027.
Key Companies profiled in this report are EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE and more in terms of market share by sales, revenue, average pricing, product type, margins, recent developments etc.
Segment by Type
- Semi-Automatic Bonding Equipment
- Fully Automatic Bonding Equipment
Segment by Application
- Advanced Packaging
Table of Content:
1 Thin Wafers Temporary Bonding Equipment Market Overview
2 Thin Wafers Temporary Bonding Equipment Market Competition by Manufacturers
3 Thin Wafers Temporary Bonding Equipment Retrospective Market Scenario by Region
4 Global Thin Wafers Temporary Bonding Equipment Historic Market Analysis by Type
5 Global Thin Wafers Temporary Bonding Equipment Historic Market Analysis by Application
6 Key Companies Profiled
7 Thin Wafers Temporary Bonding Equipment Manufacturing Cost Analysis
8 Marketing Channel, Distributors and Customers
9 Thin Wafers Temporary Bonding Equipment Market Dynamics
10 Global Thin Wafers Temporary Bonding Equipment Market Forecast
11 Research Finding and Conclusion
12 Methodology and Data Source
13 Forecast by Type and by Application (2022-2027)
14 Research Finding and Conclusion
15 Methodology and Data Source
Company Name: The Market Reports
Contact Person: Shirish Gupta
Peter Barzilai is a high school pitcher and college rower turned longtime World News journalist. Peter has also written for Buzz Feed and Huffington Post and many other major publications, Peter Loves everything about sports and loves to write on trending topics and he is DailyFactsNTrends member since 2017.