Test & Burn-in Socket Market Size Worth USD 1894.9 Mn By 2026: The Market Reports

The global Test & Burn-in Socket market was valued at US$ 1205.4 million in 2019 and it is expected to reach US$ 1894.9 million by the end of 2026, growing at a CAGR of 6.6% during 2021-2026.

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips.

An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below).

Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

As the technology of Test & Burn-in Socket is relatively mature and the downstream market, especially for semiconductor market is growing fast, so there are lots of enterprises in the Test & Burn-in Socket market. Thus the Test & Burn-in Socket market competition will be still intense. Yamaichi Electronics is the leading manufacturer in the global Test & Burn-in Socket market with the market share of 12.25%, in terms of revenue, followed by Cohu, Enplas, ISC, Smiths Interconnect, LEENO, Sensata Technologies, Johnstech, Yokowo and WinWay Technology. The top 10 companies accounted for 68% of the market share in 2018, and the top 41 companies accounted for 84%.

Global Test & Burn-in Socket Market: Drivers and Restrains

The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.

A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.

Global Test & Burn-in Socket Market: Segment Analysis

The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027.

Key Companies profiled in this report are Yamaichi Electronics, Cohu, Enplas, Isc, Smiths Interconnect, Leeno, Sensata Technologies, Johnstech, Yokowo, Winway Technology, Loranger, Plastronics, Okins Electronics, Ironwood Electronics, 3m, M Specialties, Aries Electronics, Emulation Technology, Qualmax, Micronics, Essai, Rika Denshi, Robson Technologies, Translarity, Test Tooling, Exatron, Gold Technologies, Jf Technology, Advanced and more in terms of market share by sales, revenue, average pricing, product type, margins, recent developments etc.

Find more details at: https://www.themarketreports.com/report/global-test-burn-in-socket-market-research-report

Segment by Type

  • Burn-in Socket
  • Test Socket

Test sockets accounted for the largest market share segment with 62% and the fastest growth

Segment by Application

  • Memory
  • CMOS Image Sensor
  • High Voltage
  • RF
  • SOC, CPU, GPU, etc.

SOC, CPU, GPU, etc. Occupy the largest application market share, while CMOS Image Sensor is the application with the largest growth

Table of Content:

1 Test & Burn-in Socket Market Overview

2 Test & Burn-in Socket Market Competition by Manufacturers

3 Test & Burn-in Socket Retrospective Market Scenario by Region

4 Global Test & Burn-in Socket Historic Market Analysis by Type

5 Global Test & Burn-in Socket Historic Market Analysis by Application

6 Key Companies Profiled

7 Test & Burn-in Socket Manufacturing Cost Analysis

8 Marketing Channel, Distributors and Customers

9 Test & Burn-in Socket Market Dynamics

10 Global Test & Burn-in Socket Market Forecast

11 Research Finding and Conclusion

12 Methodology and Data Source

13 Forecast by Type and by Application (2022-2027)

14 Research Finding and Conclusion

15 Methodology and Data Source

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