The global Semiconductor Package Substrates market was valued at US$ 8287 million in 2020 and it is expected to reach US$ 9273.5 million by the end of 2027, growing at a CAGR of 1.6% during 2021-2027.
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.
The main IC Substrate players include Ibiden, Unimicron, Semco, Simmtech, Kinsus, etc. The top five IC Substrate players account for approximately 46% of the total global market. Asia-Pacific is the largest consumer market for IC Substrate accounting for about 22%, followed by Europe and North America. In terms of Type, FC-BGA is the largest segment, with a share about 27%. And in terms of Application, the largest application is Smart Phones, followed by PC (Tablet, Laptop).
Global Semiconductor Package Substrates Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Semiconductor Package Substrates Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027.
Key Companies profiled in this report are Ibiden, Kinsus, Unimicron, Shinko, Semco, Simmtech, Nanya, Kyocera, LG Innotek, AT&S, ASE, Daeduck, Toppan Printing, Shennan Circuit, Zhen Ding Technology, KCC (Korea Circuit Company), Access, Shenzhen Fastprint Circuit Tech, TTM Technologies and more in terms of market share by sales, revenue, average pricing, product type, margins, recent developments etc.
Segment by Type
- WB BGA
- WB CSP
Segment by Application
- Smart Phones
- PC (Tablet, Laptop)
- Wearable Devices
Table of Content:
1 Semiconductor Package Substrates Market Overview
2 Semiconductor Package Substrates Market Competition by Manufacturers
3 Semiconductor Package Substrates Retrospective Market Scenario by Region
4 Global Semiconductor Package Substrates Historic Market Analysis by Type
5 Global Semiconductor Package Substrates Historic Market Analysis by Application
6 Key Companies Profiled
7 Semiconductor Package Substrates Manufacturing Cost Analysis
8 Marketing Channel, Distributors and Customers
9 Semiconductor Package Substrates Market Dynamics
10 Global Semiconductor Package Substrates Market Forecast
11 Research Finding and Conclusion
12 Methodology and Data Source
13 Forecast by Type and by Application (2022-2027)
14 Research Finding and Conclusion
15 Methodology and Data Source
Company Name: The Market Reports
Contact Person: Shirish Gupta
Peter Barzilai is a high school pitcher and college rower turned longtime World News journalist. Peter has also written for Buzz Feed and Huffington Post and many other major publications, Peter Loves everything about sports and loves to write on trending topics and he is DailyFactsNTrends member since 2017.